![]() The taped-out design fails final checks at the foundry due to problems manufacturing the design itself.Many different factors can cause a spin, including: Most chips will go through a series of iterations, called "spins", in which errors are detected and fixed after testing the first article. Tape-out is usually a cause for celebration by everyone who worked on the project, followed by trepidation awaiting the first article, the first physical samples of a chip from the manufacturing facility ( semiconductor foundry).įirst tapeout is rarely the end of work for the design team. The design must then go through a series of verification steps collectively known as " signoff" before it can be taped-out. Many of the steps along the way use software tools collectively known as electronic design automation (EDA). Miscellaneous Ī modern IC has to go through a long and complex design process before it is ready for tape-out. ![]() IBM differentiates between RIT-A for the non-metallic structures and RIT-B for the metal layers. Ī synonym used at IBM is RIT (release interface tape). Īt the University of California, Berkeley, the tongue-in-cheek term tape-in was coined by Professor John Wawrzynek to allude to iterative "internal tape-outs" in the spirit of agile design philosophy around 2010. ![]() However, the use of the term predates the widespread CAD usage of magnetic tape by decades. Some sources erroneously believe that the roots of the term can be traced back to the time when paper tape and later magnetic tape reels were loaded with the final electronic files used to create the photomask at the factory. This step includes resolution enhancement technologies (RET), such as optical proximity correction (OPC) which corrects for the wave-like behavior of light when etching the nano scale features of the most modern integrated circuits.
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